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Thermal Grease Paste Heat Sink Compound for CPU and Chipsets 30G (Grey)

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Grey Thermal Grease Heat Sink Compound is a non-curing, water resistant paste heavily filled with heat conductive metallic oxides in a Silicone base. It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device. Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers. Also used as a non-flammable coating for fly back transformer connections in TV chassis and similar applications. Features : High Thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C.


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